The PTC VM18002 inject via-filler is a specialized device designed to fill conductive pastes, inks, and other materials into through-holes of ceramic substrates using an air injection method. This enables the formation of electrical interconnections between different layers. Unlike traditional screen-printing via-filling, the air injection method achieves a more dense and uniform filling.This big-size via-filler plays a key role in the hole-filling process for electrostatic chucks, probe cards, heaters, HTCC, LTCC, and other applications.

The PTC VM18002 via-filler is ideal for applications requiring conductive filling with high-viscosity pastes, small through-holes, and high aspect ratios. The equipment is stable, highly precise, simple, and easy to operate, making it suitable for use in enterprises, universities, and research institutes.

Applications：
E-chuck, Probe-card,MLC,LTCC(low-temperature co-fired ceramics), HTCC(high-temperature co-fired ceramics)  and other multilayer ceramic devices industry.

Feautures：

• 12" electrostatic chuck and probe card hole-filling
• Maximum fillable product size: 450x450mm
• Suitable for hole diameters ranging from 0.05mm to 1mm
• Can fill both green tapes and sintered ceramic substrates
• Gas extrusion hole-filling, ideal for high aspect ratio and high-viscosity filling
• Easy to use, requiring only time and pressure settings
• Optional no-screen solution, reducing screen costs and enabling flexible production

Specifications：

• Fillable Product Size: 450x450mm (Max)
• Filling Area: 430x430mm (Max)
• Hole Diameter Range: 0.05mm-1mm
• Filling Pressure: 0 ~100psi (0.7MPa)
• Cycle Time: Adjustable (Standard: 20s)
• Injection Time: 0.1-99s
• Alignment System: CCD microscope
• Worktable: 4-axis adjustable
• Worktable Accuracy: ±0.0025 mm
• Paste Viscosity: 500,000 cps (Max)