PTC VM12002 Inject via-filler is a device for filling conductive pastes, inks, etc. into the through holes of ceramics by air inject method, to realize the formation of electrical interconnections between different layers. Inject via filler is different from traditional screen printing via-filling, the inject via filling can achieve a more densified hole filling effect. 

      PTC VM12002 Extruded Hole Filler is suitable for conductive filling with high paste viscosity, small through holes and high depth to width ratio. The equipment is stable, high precision, simple and easy to use, suitable for enterprises, universities and research institutes. 

Applications：
LTCC(low-temperature co-fired ceramics), HTCC(high-temperature co-fired ceramics), MLCC(multilayer ceramic capacitors), PTC/NTC , MLCI , Piezo, ceramic substrates, wave-absorbing filter materials, ferrite materials, heaters, and other multilayer ceramic devices industry.

Feautures：

Fit for ceramic green tape or sintered ceramic substrates.

Filling of holes from 0.05mm to 1mm in diameter.

Air inject hole filling, suitable for high depth width ratios

CCD vision-assisted alignment

Simple and easy to use, low maintenance cost

Optional automatic loading and unloading

Specifications：