SEMICON China 2026: Gathering Global Leaders in Electrostatic Chucks, Probe Cards, and Ceramic Heaters to Build the Core Ecosystem of Semiconductor Manufacturing

Shanghai at the Core, Components Leading the Future — SEMICON China 2026: Gathering Global Leaders in Electrostatic Chucks, Probe Cards, and Ceramic Heaters to Build the Core Ecosystem of Semiconductor Manufacturing

From March 25–27, 2026, the global semiconductor industry’s flagship event — SEMICON China 2026 — was grandly held at the Shanghai New International Expo Centre (SNIEC). Under the theme “Global Synergy, Connecting the Core”, the exhibition brought together over 1,500 companies across the global semiconductor value chain, covering an exhibition area of 90,000 square meters.

As critical components in wafer fabrication and testing, electrostatic chucks (ESCs), probe cards, and ceramic heaters took center stage. Leading global players and domestic pioneers in import substitution gathered together, highlighting breakthroughs in high-end components and showcasing the collaborative evolution of the global semiconductor ecosystem alongside the rapid rise of China’s capabilities.

I. Electrostatic Chucks (ESC): Domestic Breakthroughs Accelerate as Global Players Compete

Electrostatic chucks (ESCs) are essential components used in etching, deposition, and ion implantation processes, enabling high-precision wafer clamping and temperature control. They directly impact yield and process stability.

At this year’s exhibition, Chinese ESC manufacturers demonstrated strong momentum, presenting comprehensive solutions covering 8-inch to 12-inch wafers, from mature nodes to advanced processes.

Leading Chinese companies showcasing world-class capabilities:

• Fortune Advanced Technology, Jiangfeng Electronics, Huazhuo Jingke: Leading domestic semiconductor equipment and materials companies presented high-performance ESCs compatible with advanced nodes, closely aligned with major Chinese equipment manufacturers.
• Dinglong Co., Ltd. (Hubei Dinglong), Lead Advanced Materials (Guangdong XianDao), Chaozhou Three-Circle (CCTC), Guangdong Jingci: Leveraging advanced ceramic materials, these companies introduced high-purity, corrosion-resistant, long-lifetime ESCs, accelerating localization in advanced packaging and specialty processes.

• Junyuan Electronics, HiGood, Zhongshan Sikao, Hangzhou Dayo, Wuxi Zhuoci, Haituo Innovation: Specialized and innovative SMEs providing customized and differentiated solutions, becoming key supplements to the domestic supply chain.

Korean and international players bringing advanced technologies:

• MiCo Ceramics (Korea), Boboo (Korea): Showcased high-precision, long-lifetime ESCs, focusing on advanced process nodes and specialized applications, offering diversified solutions to global customers.

II. Probe Cards: A Flourishing Testing Ecosystem with Global Leaders and Emerging Domestic Players

Probe cards serve as the “neural endpoints” of wafer testing, responsible for transmitting electrical signals and ensuring chip quality before shipment.

This year’s exhibition featured global leaders and fast-rising Chinese companies, covering MEMS probe cards, vertical probe cards, and high-frequency probe cards, addressing testing needs in advanced logic, memory, and HBM.

Global technology leaders driving the frontier:

• FormFactor: A global leader in probe cards, presenting advanced solutions for 5nm and below nodes, supporting high-precision testing for AI chips and HBM (high-bandwidth memory).
• Nidec Advance Technology (Nidec): Leveraging MEMS and precision manufacturing technologies, showcased high-performance probe cards and MLO substrates for RF and power device testing.

Rapid rise of domestic innovators breaking foreign dominance:

• Probeleader (Liwei Electronics), Shanghai ZeFeng Semiconductor, Strong One (Qiangyi), MPI Corporation (旺矽科技): Core domestic probe card manufacturers focusing on localization, delivering cost-effective and stable products that have entered the supply chains of major Chinese foundries and OSAT companies.

  

  
  

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III. Ceramic Heaters: Global Leaders and Domestic Champions Building the Thermal Control Foundation

Ceramic heaters are core thermal control components in semiconductor chambers, providing precise and uniform temperature environments for etching, deposition, and annealing processes.

This exhibition gathered top global and domestic companies, covering thick-film, thin-film, and embedded heating technologies, suitable for extreme conditions such as high temperature, high pressure, and corrosive environments.

Global ceramic giants leading the high-end market:

• Kyocera, TOTO, NGK Insulators: World-leading advanced ceramic companies with decades of materials expertise, showcasing ultra-high purity, long-lifetime ceramic heaters dominating advanced process nodes and global equipment supply chains.

Strong rise of domestic leaders achieving large-scale substitution:

• Kema (Suzhou Kema Semiconductor Technology): A leading Chinese semiconductor ceramic components company, showcasing both ceramic heaters and ESCs, with performance comparable to international standards and already supplying major domestic equipment manufacturers.

• Yuanchuang Precision, CoreGrid (Chuangge Hongxin), Jiangyin Huilong, Sinocera: Leveraging advanced ceramic sintering and precision machining, these companies introduced cost-effective ceramic heater solutions, rapidly capturing the mid-range domestic market.

  
  

Industry Outlook: Accelerating Localization and Building a Resilient Global Ecosystem

As a global barometer of the semiconductor industry, SEMICON China 2026 clearly reflects emerging trends in core components:

• Chinese companies have progressed from technological breakthroughs to mass production, covering both mature and advanced nodes, signaling a rapid acceleration of import substitution.
• International players continue to lead in high-end technologies.
• Domestic and global companies are increasingly competing and collaborating, forming a more resilient and dynamic ecosystem.

With the explosive growth of AI computing, the evolution of memory technologies, and rapid advancements in advanced packaging, the semiconductor industry demands ever higher precision, stability, and reliability from core components.

The convergence of technologies and ecosystems at this exhibition not only injects strong momentum into the global semiconductor manufacturing chain, but also accelerates China’s transition toward high-end, large-scale, and globalized development in semiconductor core components—laying a solid foundation for the autonomy of “China Chips” and the high-quality growth of the global semiconductor industry.