The 12th China Electronic Production Equipment Industry Association-Semiconductor Equipment Annual Conference (CSEAC 2024) Concludes Successfully

On September 25, 2024, the 12th China Electronic Production Equipment Industry Association-Semiconductor Equipment Annual Conference (CSEAC 2024) and the Integrated Circuit (Wuxi) Innovation and Development Conference (ICIDC2024) successfully concluded in Wuxi, China. The conference, themed "Innovation Driven, Cooperation for Win-Win," brought together numerous experts, industry leaders, and scholars to deeply explore innovative technologies, market trends, and industry chain integration in the semiconductor equipment sector.

During the opening ceremony, leaders and experts from the Chinese Academy of Sciences, the Semiconductor Industry Association, and notable companies including Qualcomm, ACM, YANGZTE MEMORY, CR MICRO, LEUVEN-instrument, PIOTECH, WISEETEC participated. Attendees shared the latest research findings on advanced packaging technology, AI chips, and 5G, highlighting cutting-edge developments in the industry.

Additionally, several research and manufacturing companies focused on electronic ceramic semiconductor components participated in the exhibition, such as LEAD, SeaTools, Zhongshan TANISS, Beijing U-Precision, and Hebei SINOPACK. These companies play a vital role in the industry, sharing insights on the latest advancements in ceramic semiconductor components like electrostatic chucks, heaters, and probe cards.

Over the two-day event, participants engaged in 11 specialized forums covering the latest technologies and development strategies from upstream and downstream enterprises in equipment, components, and materials. The CSEAC 2024 exhibition attracted over 800 companies, showcasing the latest semiconductor equipment, materials, and technological solutions, providing a high-quality platform for companies to demonstrate innovations and expand their markets, while facilitating communication and collaboration within the industry.

Looking ahead, we anticipate further collaboration among all parties to jointly drive continuous innovation and development in the semiconductor industry, facing future challenges and opportunities together.