Easontek Showcases Latest Innovations in Electronic Ceramics at CMPE 2024

Shenzhen, China—August 30, 2024—The 6th Precision Ceramics and IGBT Industry Chain Expo (CMPE) successfully wrapped up at the Shenzhen World Convention and Exhibition Center, drawing a large crowd of industry leaders. Spanning 15,000 square meters, the three-day event featured the latest advancements in precision ceramics, electronic ceramics, ceramic substrates, ceramic packaging, and LTCC/HTCC/MLCC technologies. Alongside the exhibits, the expo hosted multiple specialized forums, with over 40 renowned experts and scholars presenting on cutting-edge topics.

Shenzhen Easontek Technology Co., Ltd., a leader in electronic ceramics, showcased its latest innovations in multilayer ceramic technology at the event. Headquartered in Shenzhen with offices in Chengdu, Suzhou, and Dalian, Easontek specializes in providing comprehensive solutions—from materials to manufacturing equipment—to a range of high-tech industries. The company is committed to advancing electronic ceramics technology, which is integral to consumer electronics, automotive electronics, communication devices, and new energy applications.

At the expo, Easontek highlighted several of its flagship products, including PTC tape casting machines, tape blanker, and punching machines, inject via-filler, stacker, laminator, cutter, all tailored for multilayer ceramic manufacturing. The company also showcased essential materials like powders, green sheets, and electronic pastes. Easontek’s offerings are widely used in producing electronic ceramic components such as MLCCs (Multilayer Ceramic Capacitors), HTCCs (High-Temperature Co-fired Ceramics), SOFC (Solid Oxide Fuel cell), and LTCCs (Low-Temperature Co-fired Ceramics). These components are critical to modern electronics, known for their superior electrical performance, thermal stability, and mechanical strength, and are used extensively in filters, capacitors, and sensors.

Guided by the principles of “Quality, Innovation, Performance,” Easontek is dedicated to driving the future of electronic ceramics. One of the highlights at their booth was the new inject via-filling machine. This advanced piece of equipment is designed for high-precision filling of small-diameter and high aspect ratio holes, ensuring uniform slurry distribution with no air pockets—making it ideal for flexible R&D and production of next-generation electronic ceramic components.

Easontek Technology used this platform to share its latest breakthroughs and to emphasize its commitment to partnering with global leaders in driving innovation within the industry. Moving forward, Yuchen Technology will continue to invest in research and development, contributing to the broader adoption of electronic ceramics across various applications.