2024 China Electronic Components Industry Summit Successfully Concludes at Wende International Exhibition Center

From September 3rd to 6th, 2024, the 9th second board meeting of the China Electronic Components Industry Association and the 2024 China Electronic Components Industry Summit were held at the Wende International Exhibition Center in Deyang. The summit brought together leading experts, academics, and key representatives from major enterprises across the electronic components industry to discuss key issues affecting the development of China's electronic components sector. The event provided strategic guidance for companies in production, technology, operations, and management.

High-Level Parallel Forums Promote Industry Collaboration

The summit featured four parallel forums, focusing on critical areas of the industry:

• 2024 Annual Conference of the Electrolytic Capacitor Specialty      of the Capacitor Branch of the China Electronic Components Industry      Association

• Annual Meeting of the Sensitive Components and Sensor Branch      and 2024 Sensor Industry Summit

• 2024 Annual Meeting of the Transformer Branch and Industry      Forum

• 9th First General Meeting and 2024 Technical Exchange      Conference of the Inductor Components Branch

As an essential part of the electronic information manufacturing sector, the electronic components industry plays a key role in supporting various strategic emerging industries. With the increasing integration of industrialization and information technology, electronic components have become indispensable across many sectors of society. The continued development of this industry is crucial for advancing China’s strategic goals in new technology and production capabilities.

Easontek technology: Leading Innovation in Multilayer Ceramic Technology

Shenzhen Easontek technology Co., Ltd., a proud member of the China Electronic Components Industry Association, showcased its latest innovations at the summit in partnership with PTC. Easontek technology specializes in multilayer ceramic technology, offering a range of advanced equipment, including tape casting machines, sheeting machines, punching machines, extrusion-type filling machines, stacking machines, isostatic presses, and hot cutting machines. The company also introduced key materials such as ceramic powders, green tapes, and electronic pastes, demonstrating its technical expertise and innovation.

Easontek technology has established itself as a leader in multilayer ceramic technology, earning recognition in both domestic and international markets. By participating in this summit, the company aims to strengthen collaboration with upstream and downstream partners in the industry, exploring new directions for the future of electronic components. Easontek technology is committed to driving industrial transformation through technological advancements, contributing to the sustainable development of the sector.

Looking Ahead: Shaping the Future Together

The successful conclusion of the 2024 China Electronic Components Industry Summit provided an essential platform for industry communication and injected fresh momentum into the development of the electronic components sector. Looking to the future, the industry will continue its journey toward high-quality growth, driving technological innovation and enhancing collaboration along the value chain. This will further support the development of China’s strategic emerging industries and lay a solid foundation for future advancements.

This summit was not only a showcase of the flourishing electronic components industry but also an invaluable opportunity for companies to learn from industry leaders and showcase their own capabilities. We look forward to seeing more enterprises, like Easontek technology, seizing opportunities and driving innovation, becoming pivotal forces in the continued growth of the industry.