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2026 China Electronic Components Summit | Easontek ESI MLCC Test Sorter for MLCC Quality Control

Author:Amy Time:2026-09-19 Hits:

September 16–18, 2026, the “4th Meeting of the 9th Council of China Electronic Components Association & 2026 China Electronic Components Industry Summit” was grandly held in Luoyang, Henan. Hosted by China Electronic Components Association and undertaken by AVIC Optoelectronics Technology Co., Ltd., the summit was co-organized by the Capacitor Branch, Connector Branch and Electronic Component Equipment & Instrument Professional Committee of the association. It gathered government regulators, academicians, industry experts and senior representatives from key backbone enterprises across more than a dozen sub-sectors and upstream & downstream industrial chains of electronic components. Shenzhen Easontek Technology Co., Ltd. was invited to attend the summit and set up a booth at the concurrent “2026 China Electronic Component Industry Chain Collaborative Innovation Exhibition”. Easontek highlighted the ESI MLCC Test Sorter (ESI Allegro / 35xxA) for MLCC R&D and manufacturers, and conducted in-depth discussions with industrial partners on MLCC quality control and mass-production testing.

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I. Summit Overview: Drawing the Blueprint for High-quality Development during the 15th Five-Year Plan

The summit opened on September 17. Wang Shijiang, Deputy Director of the Electronic Information Department of MIIT, Wang Taigang, Vice Mayor of Luoyang Municipal People’s Government and representatives of the organizer delivered speeches successively. Gu Qun, Resident Vice Chairman of China Electronic Components Association, delivered the opening address.

At the meeting, the association, together with key industrial enterprises, released the Report on High-quality Development of the Electronic Components Industry during the 15th Five-Year Plan (2026–2030), pointing out the development direction for China’s electronic components industry in the next five years. In the keynote session, experts from H3C, Harbin Institute of Technology, China Academy of Information and Communications Technology, China Academy of Engineering Physics, AVIC Optoelectronics and other institutions shared insights on cutting-edge topics including component transformation in the era of computing power explosion, high-speed transmission and interconnection under AI computing power, intelligent quality control for component manufacturing, space radiation environment and component reliability.

Notably, the summit held the handover ceremony for the rotating chairman of the council. Guangdong Fenghua Advanced Technology Holding Co., Ltd., a leading MLCC enterprise, took over as the next rotating chairman unit. This reflects the vigorous growth of the MLCC industry driven by strong demand from AI servers, new energy vehicles, optical modules and other markets.


II. Concurrent Exhibition: Concentrated Display of Industrial Chain Collaborative Innovation

To boost integrated development of the electronic components industrial chain, the summit hosted the “2026 China Electronic Component Industry Chain Collaborative Innovation Exhibition”. A total of 50 industrial enterprises exhibited their latest products and technologies covering key segments such as equipment & instruments, materials and components, building an efficient technical docking platform for equipment suppliers and electronic component manufacturers.


III. Booth Highlight: ESI MLCC Test Sorter, Built for MLCC Mass Production Testing

As a solution provider specializing in electronic ceramics and advanced manufacturing, Easontek presented the ESI MLCC Test Sorter (ESI Allegro / 35xxA) at the booth. It is a high-speed rotary test system designed for MLCC mass-production testing and sorting, attracting many visitors from MLCC R&D & manufacturing companies and equipment peers.

Product Highlights

High Throughput & Parallel Testing: Adopting ESI patented rotary handling technology, the system supports 8 tracks with up to 25 test stations. The maximum throughput reaches 20,000 pieces per minute (1.2 million pieces per hour), delivering ultra-high capacity while effectively reducing total cost of ownership (TCO).

All-in-one Testing & Sorting: Completes capacitance (C), dissipation factor (Df) and bipolar insulation resistance (IR) measurement and classification in a single system. It supports standard test frequencies of 120Hz / 1kHz / 1MHz, capacitance measurement range from 1pF to 1mF, DC IR test voltage of 1~600V (bipolar optional). With optional withstand voltage / Flash test function.

Precise Contact for Reliable Quality: The patented Roller Contacts structure minimizes terminal indentation. Contact force is computer-programmed and kept constant. With optional PAC configuration, it stably handles chip sizes ranging from M0402 (01005) to M2012 (0805).

Flexible Sorting: Equipped with 9 sorting bins (up to 7 bins for capacitance tolerance grading + up to 7 bins for defective parts + 1 re-test bin). BIN1~BIN8 judgment criteria can be freely configured to adapt to diverse grading processes.

Intelligent Software: Chinese UI, supports CD/IR parameter setup, real-time monitoring and graphical data visualization. Optional network control and MES docking for seamless integration into customers’ intelligent manufacturing systems.


IV. Beyond Testing: One-stop Electronic Ceramic Solutions

Easontek has long focused on electronic ceramic process systems. Our products and services cover HTCC, LTCC, MLCC, MLCI, PZT, SOFC, SOEC, electrostatic chucks, heaters, probe cards, solid-state batteries and other fields.

Processing Equipment: PTC tape casters, blanking machines, punchers, via-fillers, screen printers, stacking machines, warm isostatic presses, hot cutting machines and other full-line production equipment; auxiliary equipment including ball mills, three-roll mills, high-precision homogenizers and precision chamfering machines.

Testing & Measurement: ESI MLCC test & sorting systems, TOYO ferroelectric analyzers, AOI automatic optical inspectors, thickness gauges, etc., covering full-process quality control from material electrical property analysis to device electrical testing and visual inspection.

Key Materials: Green tapes, ceramic powders, electronic pastes and other basic materials, with supporting services for material selection and process optimization.

From MLCC R&D sampling to mass sorting, from material selection to production line planning, Easontek strives to be a trusted long-term partner for MLCC and electronic ceramic manufacturers.


V. Closing Remarks

During the three-day summit and exhibition, Easontek held face-to-face in-depth exchanges with many MLCC R&D & production enterprises and industry peers, gaining valuable technical discussions and cooperation intentions. We appreciate China Electronic Components Association for building this high-level platform, and thank all industry friends who visited our booth!

Taking this summit as an opportunity, Easontek will continue to provide more professional and efficient products and services for customers across the MLCC and electronic ceramic industrial chain, and support the high-quality development of China’s electronic components industry during the 15th Five-Year Plan.

Looking forward to meeting you again!


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